Honeywell|51454416-100|HPM I/O Link Module
Honeywell 51454416-100 HPM I/O Link Module
Description
Honeywell 51454416-100 is a High Performance Process Manager (HPM) I/O Link Module designed for the TDC 3000 Distributed Control System to facilitate high-speed data communication between the HPM processor and field I/O carriers.
Honeywell 51454416-100 is a High Performance Process Manager (HPM) I/O Link Module designed for the TDC 3000 Distributed Control System to facilitate high-speed data communication between the HPM processor and field I/O carriers.
Features
Enables redundant or non-redundant I/O configurations. Supports multiple I/O carrier connections. Ensures deterministic data transfer for critical process control. Compatible with legacy TDC 3000 architectures.
Enables redundant or non-redundant I/O configurations. Supports multiple I/O carrier connections. Ensures deterministic data transfer for critical process control. Compatible with legacy TDC 3000 architectures.
Technical Specifications
- System Compatibility: Honeywell TDC 3000 LCN/UCN Network Architecture
- Module Type: HPM I/O Link Interface Board
- Data Transfer Rate: High-speed synchronous communication optimized for process control cycles
- I/O Capacity: Supports connection to multiple Universal I/O (UIO) carriers per link
- Redundancy Support: Configurable for fully redundant I/O link operations to ensure system availability
- Operating Temperature: 0°C to 60°C (32°F to 140°F) typical industrial range
- Power Requirement: Powered via HPM backplane, standard 5 VDC logic levels
- Communication Protocol: Proprietary HPM I/O Link Protocol
- Slot Configuration: Occupies specific I/O Link slot within HPM cabinet assembly
- Reliability: Designed for continuous operation with mean time between failures (MTBF) exceeding 100,000 hours
- Physical Dimensions: Standard Eurocard form factor fitting HPM chassis slots
- Weight: Approximately 0.5 kg including connectors
Honeywell|51454416-100|HPM I/O Link Module
Current product
Current
Vendor:
Honeywell
Honeywell|51454416-100|HPM I/O Link Module
Regular price
$100.00
Sale price
$100.00
Regular price
$300.00
Options
Descriptions
Honeywell 51454416-100 HPM I/O Link Module
Description
Honeywell 51454416-100 is a High Performance Process Manager (HPM) I/O Link Module designed for the TDC 3000 Distributed Control System to facilitate high-speed data communication between the HPM processor and field I/O carriers.
Honeywell 51454416-100 is a High Performance Process Manager (HPM) I/O Link Module designed for the TDC 3000 Distributed Control System to facilitate high-speed data communication between the HPM processor and field I/O carriers.
Features
Enables redundant or non-redundant I/O configurations. Supports multiple I/O carrier connections. Ensures deterministic data transfer for critical process control. Compatible with legacy TDC 3000 architectures.
Enables redundant or non-redundant I/O configurations. Supports multiple I/O carrier connections. Ensures deterministic data transfer for critical process control. Compatible with legacy TDC 3000 architectures.
Technical Specifications
- System Compatibility: Honeywell TDC 3000 LCN/UCN Network Architecture
- Module Type: HPM I/O Link Interface Board
- Data Transfer Rate: High-speed synchronous communication optimized for process control cycles
- I/O Capacity: Supports connection to multiple Universal I/O (UIO) carriers per link
- Redundancy Support: Configurable for fully redundant I/O link operations to ensure system availability
- Operating Temperature: 0°C to 60°C (32°F to 140°F) typical industrial range
- Power Requirement: Powered via HPM backplane, standard 5 VDC logic levels
- Communication Protocol: Proprietary HPM I/O Link Protocol
- Slot Configuration: Occupies specific I/O Link slot within HPM cabinet assembly
- Reliability: Designed for continuous operation with mean time between failures (MTBF) exceeding 100,000 hours
- Physical Dimensions: Standard Eurocard form factor fitting HPM chassis slots
- Weight: Approximately 0.5 kg including connectors
