GE Fanuc|IS200JPDEG1ABB|I/O Pack Interface Module
GE Fanuc IS200JPDEG1ABB I/O Pack Interface Module
Description
The GE Fanuc IS200JPDEG1ABB is an I/O pack interface module used in the Mark VIe turbine control system to provide signal routing and electrical isolation between controller cores and field terminal boards.
Features
- Supports redundant I/O communication
- Hot-swappable for maintenance without shutdown
- Integrates diagnostic LEDs for status monitoring
- Connects to multiple terminal board types
Technical Specifications
- Model Number: IS200JPDEG1ABB
- Manufacturer: General Electric (GE Fanuc)
- System Platform: Mark VIe
- Function: I/O signal distribution and isolation
- Communication Interface: Dual Ethernet (100 Mbps) via fiber-optic or copper (SERCOS III protocol)
-
Connectors:
- Two RJ-45 or fiber LC ports for redundant network loops
- Backplane connector compatible with VME-style I/O chassis
- Power Supply: +24 V DC nominal, typical power draw under 10 W
- Operating Temperature: 0°C to 60°C
- Storage Temperature: –40°C to 85°C
- Relative Humidity: 5% to 95%, non-condensing
- Mounting: Slide-in module for standard Mark VIe I/O core racks (R/S/T cores)
- Indicators: Link/activity LEDs, module OK/status LED
- Compliance: CE, UL, CSA certified
- Dimensions: Approx. 240 mm (H) × 30 mm (W) × 200 mm (D)
- Weight: ~0.75 kg
GE Fanuc|IS200JPDEG1ABB|I/O Pack Interface Module
GE Fanuc|IS200JPDEG1ABB|I/O Pack Interface Module
GE Fanuc IS200JPDEG1ABB I/O Pack Interface Module
Description
The GE Fanuc IS200JPDEG1ABB is an I/O pack interface module used in the Mark VIe turbine control system to provide signal routing and electrical isolation between controller cores and field terminal boards.
Features
- Supports redundant I/O communication
- Hot-swappable for maintenance without shutdown
- Integrates diagnostic LEDs for status monitoring
- Connects to multiple terminal board types
Technical Specifications
- Model Number: IS200JPDEG1ABB
- Manufacturer: General Electric (GE Fanuc)
- System Platform: Mark VIe
- Function: I/O signal distribution and isolation
- Communication Interface: Dual Ethernet (100 Mbps) via fiber-optic or copper (SERCOS III protocol)
-
Connectors:
- Two RJ-45 or fiber LC ports for redundant network loops
- Backplane connector compatible with VME-style I/O chassis
- Power Supply: +24 V DC nominal, typical power draw under 10 W
- Operating Temperature: 0°C to 60°C
- Storage Temperature: –40°C to 85°C
- Relative Humidity: 5% to 95%, non-condensing
- Mounting: Slide-in module for standard Mark VIe I/O core racks (R/S/T cores)
- Indicators: Link/activity LEDs, module OK/status LED
- Compliance: CE, UL, CSA certified
- Dimensions: Approx. 240 mm (H) × 30 mm (W) × 200 mm (D)
- Weight: ~0.75 kg
