HONEYWELL|51304337-200|HPM I/O Link Module
Honeywell 51304337-200 HPM I/O Link Module
Description
Honeywell 51304337-200 is a specific High-Performance Process Manager (HPM) I/O Link interface module designed for Honeywell TDC 3000 systems to connect processor units with field input/output subsystems.
Honeywell 51304337-200 is a specific High-Performance Process Manager (HPM) I/O Link interface module designed for Honeywell TDC 3000 systems to connect processor units with field input/output subsystems.
Features
- Connects HPM processors to I/O links
- Supports redundant communication paths
- Enables high-speed data transfer
- Compatible with TDC 3000 architecture
Technical Specifications
- Part Number: 51304337-200
- Product Type: HPM I/O Link Module
- System Compatibility: TDC 3000 HPM
- Interface Type: Serial I/O Link
- Voltage Input: 24 VDC nominal
- Operating Voltage Range: 19.2 to 30 VDC
- Power Consumption: 8 W maximum
- Operating Temperature: 0 to 60 degrees Celsius
- Storage Temperature: -40 to 85 degrees Celsius
- Relative Humidity: 5 to 95 percent non-condensing
- Dimensions: 22.0 cm height, 14.0 cm width, 26.0 cm depth
- Weight: 1.5 kg approximately
- Mounting Type: HPM Cabinet Rack
- Communication Protocol: Proprietary HPM Link
- Data Transfer Rate: 1 Mbps
- Link Capacity: Supports up to 4 I/O links per module
- Max Distance: 150 meters per link segment
- MTBF: Over 130,000 hours
- Certification: UL, CE, FM approved
HONEYWELL|51304337-200|HPM I/O Link Module
Current product
Current
Vendor:
Honeywell
HONEYWELL|51304337-200|HPM I/O Link Module
Regular price
$100.00
Sale price
$100.00
Regular price
$300.00
Options
Descriptions
Honeywell 51304337-200 HPM I/O Link Module
Description
Honeywell 51304337-200 is a specific High-Performance Process Manager (HPM) I/O Link interface module designed for Honeywell TDC 3000 systems to connect processor units with field input/output subsystems.
Honeywell 51304337-200 is a specific High-Performance Process Manager (HPM) I/O Link interface module designed for Honeywell TDC 3000 systems to connect processor units with field input/output subsystems.
Features
- Connects HPM processors to I/O links
- Supports redundant communication paths
- Enables high-speed data transfer
- Compatible with TDC 3000 architecture
Technical Specifications
- Part Number: 51304337-200
- Product Type: HPM I/O Link Module
- System Compatibility: TDC 3000 HPM
- Interface Type: Serial I/O Link
- Voltage Input: 24 VDC nominal
- Operating Voltage Range: 19.2 to 30 VDC
- Power Consumption: 8 W maximum
- Operating Temperature: 0 to 60 degrees Celsius
- Storage Temperature: -40 to 85 degrees Celsius
- Relative Humidity: 5 to 95 percent non-condensing
- Dimensions: 22.0 cm height, 14.0 cm width, 26.0 cm depth
- Weight: 1.5 kg approximately
- Mounting Type: HPM Cabinet Rack
- Communication Protocol: Proprietary HPM Link
- Data Transfer Rate: 1 Mbps
- Link Capacity: Supports up to 4 I/O links per module
- Max Distance: 150 meters per link segment
- MTBF: Over 130,000 hours
- Certification: UL, CE, FM approved
