Honeywell|51155506-140|HPM High Level I/O Link Module
Honeywell 51155506-140 HPM High Level I/O Link Module
Description
Honeywell 51155506-140 is a High-Performance Process Manager (HPM) High Level I/O Link module designed for the TDC 3000 Distributed Control System to interface with high-level field devices and subsystems.
Honeywell 51155506-140 is a High-Performance Process Manager (HPM) High Level I/O Link module designed for the TDC 3000 Distributed Control System to interface with high-level field devices and subsystems.
Features
High-level signal interfacing capability.
Supports redundant communication architecture.
Robust noise immunity for industrial environments.
Seamless UCN network integration.
High-level signal interfacing capability.
Supports redundant communication architecture.
Robust noise immunity for industrial environments.
Seamless UCN network integration.
Technical Specifications
System Compatibility
Designed for Honeywell TDC 3000 and TPS systems.
Interfaces with HPM Processor and other I/O Link modules.
Supports Universal Control Network (UCN) protocols.
System Compatibility
Designed for Honeywell TDC 3000 and TPS systems.
Interfaces with HPM Processor and other I/O Link modules.
Supports Universal Control Network (UCN) protocols.
Performance Metrics
Data transfer rate optimized for high-level I/O control.
Supports up to 40 high-level I/O points per link.
Communication cycle time typically under 8 milliseconds.
Signal update rate up to 125 Hz for process variables.
Data transfer rate optimized for high-level I/O control.
Supports up to 40 high-level I/O points per link.
Communication cycle time typically under 8 milliseconds.
Signal update rate up to 125 Hz for process variables.
Electrical Characteristics
Operating Voltage: 24 VDC nominal.
Voltage Range: 19.2 VDC to 30 VDC.
Power Consumption: Approximately 12 Watts typical.
Current Draw: 500 mA at 24 VDC.
Input Impedance: Greater than 15 kOhm.
Isolation Voltage: 500 VAC channel-to-backplane.
Operating Voltage: 24 VDC nominal.
Voltage Range: 19.2 VDC to 30 VDC.
Power Consumption: Approximately 12 Watts typical.
Current Draw: 500 mA at 24 VDC.
Input Impedance: Greater than 15 kOhm.
Isolation Voltage: 500 VAC channel-to-backplane.
Environmental Ratings
Operating Temperature Range: 0°C to 60°C (32°F to 140°F).
Storage Temperature Range: -40°C to 85°C (-40°F to 185°F).
Relative Humidity: 5% to 95% non-condensing.
Vibration Resistance: Compliant with ISA G1 standard.
Operating Temperature Range: 0°C to 60°C (32°F to 140°F).
Storage Temperature Range: -40°C to 85°C (-40°F to 185°F).
Relative Humidity: 5% to 95% non-condensing.
Vibration Resistance: Compliant with ISA G1 standard.
Physical Dimensions
Module Form Factor: Standard HPM card size.
Weight: Approximate 0.5 kg.
Module Form Factor: Standard HPM card size.
Weight: Approximate 0.5 kg.
Honeywell|51155506-140|HPM High Level I/O Link Module
Current product
Current
Vendor:
Honeywell
Honeywell|51155506-140|HPM High Level I/O Link Module
Regular price
$100.00
Sale price
$100.00
Regular price
$300.00
Options
Descriptions
Honeywell 51155506-140 HPM High Level I/O Link Module
Description
Honeywell 51155506-140 is a High-Performance Process Manager (HPM) High Level I/O Link module designed for the TDC 3000 Distributed Control System to interface with high-level field devices and subsystems.
Honeywell 51155506-140 is a High-Performance Process Manager (HPM) High Level I/O Link module designed for the TDC 3000 Distributed Control System to interface with high-level field devices and subsystems.
Features
High-level signal interfacing capability.
Supports redundant communication architecture.
Robust noise immunity for industrial environments.
Seamless UCN network integration.
High-level signal interfacing capability.
Supports redundant communication architecture.
Robust noise immunity for industrial environments.
Seamless UCN network integration.
Technical Specifications
System Compatibility
Designed for Honeywell TDC 3000 and TPS systems.
Interfaces with HPM Processor and other I/O Link modules.
Supports Universal Control Network (UCN) protocols.
System Compatibility
Designed for Honeywell TDC 3000 and TPS systems.
Interfaces with HPM Processor and other I/O Link modules.
Supports Universal Control Network (UCN) protocols.
Performance Metrics
Data transfer rate optimized for high-level I/O control.
Supports up to 40 high-level I/O points per link.
Communication cycle time typically under 8 milliseconds.
Signal update rate up to 125 Hz for process variables.
Data transfer rate optimized for high-level I/O control.
Supports up to 40 high-level I/O points per link.
Communication cycle time typically under 8 milliseconds.
Signal update rate up to 125 Hz for process variables.
Electrical Characteristics
Operating Voltage: 24 VDC nominal.
Voltage Range: 19.2 VDC to 30 VDC.
Power Consumption: Approximately 12 Watts typical.
Current Draw: 500 mA at 24 VDC.
Input Impedance: Greater than 15 kOhm.
Isolation Voltage: 500 VAC channel-to-backplane.
Operating Voltage: 24 VDC nominal.
Voltage Range: 19.2 VDC to 30 VDC.
Power Consumption: Approximately 12 Watts typical.
Current Draw: 500 mA at 24 VDC.
Input Impedance: Greater than 15 kOhm.
Isolation Voltage: 500 VAC channel-to-backplane.
Environmental Ratings
Operating Temperature Range: 0°C to 60°C (32°F to 140°F).
Storage Temperature Range: -40°C to 85°C (-40°F to 185°F).
Relative Humidity: 5% to 95% non-condensing.
Vibration Resistance: Compliant with ISA G1 standard.
Operating Temperature Range: 0°C to 60°C (32°F to 140°F).
Storage Temperature Range: -40°C to 85°C (-40°F to 185°F).
Relative Humidity: 5% to 95% non-condensing.
Vibration Resistance: Compliant with ISA G1 standard.
Physical Dimensions
Module Form Factor: Standard HPM card size.
Weight: Approximate 0.5 kg.
Module Form Factor: Standard HPM card size.
Weight: Approximate 0.5 kg.
