Honeywell|51155506-130|HPM Low Level I/O Link Module
Honeywell 51155506-130 HPM Low Level I/O Link Module
Description
Honeywell 51155506-130 is a High-Performance Process Manager (HPM) Low Level I/O Link module designed for the TDC 3000 Distributed Control System to interface directly with field input/output devices.
Honeywell 51155506-130 is a High-Performance Process Manager (HPM) Low Level I/O Link module designed for the TDC 3000 Distributed Control System to interface directly with field input/output devices.
Features
Direct low-level signal interfacing.
Supports redundant communication paths.
High noise immunity design.
Compatible with UCN network architecture.
Direct low-level signal interfacing.
Supports redundant communication paths.
High noise immunity design.
Compatible with UCN network architecture.
Technical Specifications
System Compatibility
Designed for Honeywell TDC 3000 and TPS systems.
Interfaces with HPM Processor and I/O Link modules.
Supports Universal Control Network (UCN) protocols.
System Compatibility
Designed for Honeywell TDC 3000 and TPS systems.
Interfaces with HPM Processor and I/O Link modules.
Supports Universal Control Network (UCN) protocols.
Performance Metrics
Data transfer rate optimized for direct I/O control.
Supports up to 40 I/O points per link configuration.
Communication cycle time typically under 5 milliseconds.
Signal update rate up to 200 Hz for critical loops.
Data transfer rate optimized for direct I/O control.
Supports up to 40 I/O points per link configuration.
Communication cycle time typically under 5 milliseconds.
Signal update rate up to 200 Hz for critical loops.
Electrical Characteristics
Operating Voltage: 24 VDC nominal.
Voltage Range: 19.2 VDC to 30 VDC.
Power Consumption: Approximately 10 Watts typical.
Current Draw: 420 mA at 24 VDC.
Input Impedance: Greater than 10 kOhm.
Isolation Voltage: 500 VAC channel-to-backplane.
Operating Voltage: 24 VDC nominal.
Voltage Range: 19.2 VDC to 30 VDC.
Power Consumption: Approximately 10 Watts typical.
Current Draw: 420 mA at 24 VDC.
Input Impedance: Greater than 10 kOhm.
Isolation Voltage: 500 VAC channel-to-backplane.
Environmental Ratings
Operating Temperature Range: 0°C to 60°C (32°F to 140°F).
Storage Temperature Range: -40°C to 85°C (-40°F to 185°F).
Relative Humidity: 5% to 95% non-condensing.
Vibration Resistance: Compliant with ISA G1 standard.
Operating Temperature Range: 0°C to 60°C (32°F to 140°F).
Storage Temperature Range: -40°C to 85°C (-40°F to 185°F).
Relative Humidity: 5% to 95% non-condensing.
Vibration Resistance: Compliant with ISA G1 standard.
Physical Dimensions
Module Form Factor: Standard HPM card size.
Weight: Approximate 0.48 kg.
Module Form Factor: Standard HPM card size.
Weight: Approximate 0.48 kg.
Honeywell|51155506-130|HPM Low Level I/O Link Module
Current product
Current
Vendor:
Honeywell
Honeywell|51155506-130|HPM Low Level I/O Link Module
Regular price
$100.00
Sale price
$100.00
Regular price
$300.00
Options
Descriptions
Honeywell 51155506-130 HPM Low Level I/O Link Module
Description
Honeywell 51155506-130 is a High-Performance Process Manager (HPM) Low Level I/O Link module designed for the TDC 3000 Distributed Control System to interface directly with field input/output devices.
Honeywell 51155506-130 is a High-Performance Process Manager (HPM) Low Level I/O Link module designed for the TDC 3000 Distributed Control System to interface directly with field input/output devices.
Features
Direct low-level signal interfacing.
Supports redundant communication paths.
High noise immunity design.
Compatible with UCN network architecture.
Direct low-level signal interfacing.
Supports redundant communication paths.
High noise immunity design.
Compatible with UCN network architecture.
Technical Specifications
System Compatibility
Designed for Honeywell TDC 3000 and TPS systems.
Interfaces with HPM Processor and I/O Link modules.
Supports Universal Control Network (UCN) protocols.
System Compatibility
Designed for Honeywell TDC 3000 and TPS systems.
Interfaces with HPM Processor and I/O Link modules.
Supports Universal Control Network (UCN) protocols.
Performance Metrics
Data transfer rate optimized for direct I/O control.
Supports up to 40 I/O points per link configuration.
Communication cycle time typically under 5 milliseconds.
Signal update rate up to 200 Hz for critical loops.
Data transfer rate optimized for direct I/O control.
Supports up to 40 I/O points per link configuration.
Communication cycle time typically under 5 milliseconds.
Signal update rate up to 200 Hz for critical loops.
Electrical Characteristics
Operating Voltage: 24 VDC nominal.
Voltage Range: 19.2 VDC to 30 VDC.
Power Consumption: Approximately 10 Watts typical.
Current Draw: 420 mA at 24 VDC.
Input Impedance: Greater than 10 kOhm.
Isolation Voltage: 500 VAC channel-to-backplane.
Operating Voltage: 24 VDC nominal.
Voltage Range: 19.2 VDC to 30 VDC.
Power Consumption: Approximately 10 Watts typical.
Current Draw: 420 mA at 24 VDC.
Input Impedance: Greater than 10 kOhm.
Isolation Voltage: 500 VAC channel-to-backplane.
Environmental Ratings
Operating Temperature Range: 0°C to 60°C (32°F to 140°F).
Storage Temperature Range: -40°C to 85°C (-40°F to 185°F).
Relative Humidity: 5% to 95% non-condensing.
Vibration Resistance: Compliant with ISA G1 standard.
Operating Temperature Range: 0°C to 60°C (32°F to 140°F).
Storage Temperature Range: -40°C to 85°C (-40°F to 185°F).
Relative Humidity: 5% to 95% non-condensing.
Vibration Resistance: Compliant with ISA G1 standard.
Physical Dimensions
Module Form Factor: Standard HPM card size.
Weight: Approximate 0.48 kg.
Module Form Factor: Standard HPM card size.
Weight: Approximate 0.48 kg.
