Honeywell|51155506-120|HPM I/O Link Module
Honeywell 51155506-120 HPM I/O Link Module
Description
Honeywell 51155506-120 is a High-Performance Process Manager (HPM) I/O Link module designed for the TDC 3000 Distributed Control System (DCS) to facilitate communication between the HPM processor and I/O subsystems.
Honeywell 51155506-120 is a High-Performance Process Manager (HPM) I/O Link module designed for the TDC 3000 Distributed Control System (DCS) to facilitate communication between the HPM processor and I/O subsystems.
Features
High-speed data link interface.
Supports redundant I/O configurations.
Compatible with UCN network architecture.
Enhanced signal processing reliability.
High-speed data link interface.
Supports redundant I/O configurations.
Compatible with UCN network architecture.
Enhanced signal processing reliability.
Technical Specifications
System Compatibility
Designed for Honeywell TDC 3000 and TPS systems.
Interfaces directly with HPM Processor Modules.
Supports Universal Control Network (UCN) protocols.
System Compatibility
Designed for Honeywell TDC 3000 and TPS systems.
Interfaces directly with HPM Processor Modules.
Supports Universal Control Network (UCN) protocols.
Performance Metrics
Data transfer rate optimized for real-time control loops.
Supports up to 40 I/O links per HPM system.
Latency minimized for critical process variables.
Communication cycle time typically under 10 milliseconds.
Data transfer rate optimized for real-time control loops.
Supports up to 40 I/O links per HPM system.
Latency minimized for critical process variables.
Communication cycle time typically under 10 milliseconds.
Electrical Characteristics
Operating Voltage: 24 VDC nominal.
Voltage Range: 19.2 VDC to 30 VDC.
Power Consumption: Approximately 8 Watts typical.
Current Draw: 330 mA at 24 VDC.
Isolation Voltage: 500 VAC for signal protection.
Operating Voltage: 24 VDC nominal.
Voltage Range: 19.2 VDC to 30 VDC.
Power Consumption: Approximately 8 Watts typical.
Current Draw: 330 mA at 24 VDC.
Isolation Voltage: 500 VAC for signal protection.
Environmental Ratings
Operating Temperature Range: 0°C to 60°C (32°F to 140°F).
Storage Temperature Range: -40°C to 85°C (-40°F to 185°F).
Relative Humidity: 5% to 95% non-condensing.
Vibration Resistance: Compliant with ISA G1 standard.
Operating Temperature Range: 0°C to 60°C (32°F to 140°F).
Storage Temperature Range: -40°C to 85°C (-40°F to 185°F).
Relative Humidity: 5% to 95% non-condensing.
Vibration Resistance: Compliant with ISA G1 standard.
Physical Dimensions
Module Form Factor: Standard HPM card size.
Weight: Approximate 0.45 kg.
Module Form Factor: Standard HPM card size.
Weight: Approximate 0.45 kg.
Honeywell|51155506-120|HPM I/O Link Module
Current product
Current
Vendor:
Honeywell
Honeywell|51155506-120|HPM I/O Link Module
Regular price
$100.00
Sale price
$100.00
Regular price
$300.00
Options
Descriptions
Honeywell 51155506-120 HPM I/O Link Module
Description
Honeywell 51155506-120 is a High-Performance Process Manager (HPM) I/O Link module designed for the TDC 3000 Distributed Control System (DCS) to facilitate communication between the HPM processor and I/O subsystems.
Honeywell 51155506-120 is a High-Performance Process Manager (HPM) I/O Link module designed for the TDC 3000 Distributed Control System (DCS) to facilitate communication between the HPM processor and I/O subsystems.
Features
High-speed data link interface.
Supports redundant I/O configurations.
Compatible with UCN network architecture.
Enhanced signal processing reliability.
High-speed data link interface.
Supports redundant I/O configurations.
Compatible with UCN network architecture.
Enhanced signal processing reliability.
Technical Specifications
System Compatibility
Designed for Honeywell TDC 3000 and TPS systems.
Interfaces directly with HPM Processor Modules.
Supports Universal Control Network (UCN) protocols.
System Compatibility
Designed for Honeywell TDC 3000 and TPS systems.
Interfaces directly with HPM Processor Modules.
Supports Universal Control Network (UCN) protocols.
Performance Metrics
Data transfer rate optimized for real-time control loops.
Supports up to 40 I/O links per HPM system.
Latency minimized for critical process variables.
Communication cycle time typically under 10 milliseconds.
Data transfer rate optimized for real-time control loops.
Supports up to 40 I/O links per HPM system.
Latency minimized for critical process variables.
Communication cycle time typically under 10 milliseconds.
Electrical Characteristics
Operating Voltage: 24 VDC nominal.
Voltage Range: 19.2 VDC to 30 VDC.
Power Consumption: Approximately 8 Watts typical.
Current Draw: 330 mA at 24 VDC.
Isolation Voltage: 500 VAC for signal protection.
Operating Voltage: 24 VDC nominal.
Voltage Range: 19.2 VDC to 30 VDC.
Power Consumption: Approximately 8 Watts typical.
Current Draw: 330 mA at 24 VDC.
Isolation Voltage: 500 VAC for signal protection.
Environmental Ratings
Operating Temperature Range: 0°C to 60°C (32°F to 140°F).
Storage Temperature Range: -40°C to 85°C (-40°F to 185°F).
Relative Humidity: 5% to 95% non-condensing.
Vibration Resistance: Compliant with ISA G1 standard.
Operating Temperature Range: 0°C to 60°C (32°F to 140°F).
Storage Temperature Range: -40°C to 85°C (-40°F to 185°F).
Relative Humidity: 5% to 95% non-condensing.
Vibration Resistance: Compliant with ISA G1 standard.
Physical Dimensions
Module Form Factor: Standard HPM card size.
Weight: Approximate 0.45 kg.
Module Form Factor: Standard HPM card size.
Weight: Approximate 0.45 kg.
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