Honeywell|51454416-300|HPM I/O Link Module
Honeywell 51454416-300 HPM I/O Link Module
Description
Honeywell 51454416-300 is a High Performance Process Manager (HPM) I/O Link Module designed for the TDC 3000 Distributed Control System to enable high-speed, redundant communication between the HPM processor and Universal I/O carriers.
Honeywell 51454416-300 is a High Performance Process Manager (HPM) I/O Link Module designed for the TDC 3000 Distributed Control System to enable high-speed, redundant communication between the HPM processor and Universal I/O carriers.
Features
Supports fully redundant I/O link architecture for critical process availability. Connects HPM processors to multiple I/O carriers simultaneously. Ensures deterministic data transfer with low latency. Compatible with TDC 3000 LCN and UCN network environments.
Supports fully redundant I/O link architecture for critical process availability. Connects HPM processors to multiple I/O carriers simultaneously. Ensures deterministic data transfer with low latency. Compatible with TDC 3000 LCN and UCN network environments.
Technical Specifications
- System Compatibility: Honeywell TDC 3000 LCN/UCN Network Architecture
- Module Type: Redundant HPM I/O Link Interface Board
- Part Number: 51454416-300
- Data Transfer Rate: High-speed synchronous communication optimized for sub-second control cycles
- I/O Capacity: Supports connection to up to 40 Universal I/O (UIO) carriers per redundant link pair
- Redundancy Support: Hardware-based dual-link redundancy with automatic failover in less than 1 second
- Operating Temperature: 0°C to 60°C (32°F to 140°F) industrial grade range
- Storage Temperature: -40°C to 85°C (-40°F to 185°F)
- Power Requirement: Powered via HPM backplane, nominal 5 VDC ±5% logic levels
- Current Consumption: Approximately 1.3 A at 5 VDC typical operation
- Communication Protocol: Proprietary Honeywell HPM I/O Link Protocol
- Slot Configuration: Occupies dedicated I/O Link slots A and B within HPM cabinet for redundancy
- Reliability: Mean Time Between Failures (MTBF) exceeding 150,000 hours in redundant configuration
- Physical Dimensions: Standard Eurocard form factor 100 mm x 160 mm fitting HPM chassis
- Weight: Approximately 0.55 kg including heavy-duty connectors
- Humidity Range: 5% to 95% non-condensing relative humidity
Honeywell|51454416-300|HPM I/O Link Module
Current product
Current
Vendor:
Honeywell
Honeywell|51454416-300|HPM I/O Link Module
Regular price
$100.00
Sale price
$100.00
Regular price
$300.00
Options
Descriptions
Honeywell 51454416-300 HPM I/O Link Module
Description
Honeywell 51454416-300 is a High Performance Process Manager (HPM) I/O Link Module designed for the TDC 3000 Distributed Control System to enable high-speed, redundant communication between the HPM processor and Universal I/O carriers.
Honeywell 51454416-300 is a High Performance Process Manager (HPM) I/O Link Module designed for the TDC 3000 Distributed Control System to enable high-speed, redundant communication between the HPM processor and Universal I/O carriers.
Features
Supports fully redundant I/O link architecture for critical process availability. Connects HPM processors to multiple I/O carriers simultaneously. Ensures deterministic data transfer with low latency. Compatible with TDC 3000 LCN and UCN network environments.
Supports fully redundant I/O link architecture for critical process availability. Connects HPM processors to multiple I/O carriers simultaneously. Ensures deterministic data transfer with low latency. Compatible with TDC 3000 LCN and UCN network environments.
Technical Specifications
- System Compatibility: Honeywell TDC 3000 LCN/UCN Network Architecture
- Module Type: Redundant HPM I/O Link Interface Board
- Part Number: 51454416-300
- Data Transfer Rate: High-speed synchronous communication optimized for sub-second control cycles
- I/O Capacity: Supports connection to up to 40 Universal I/O (UIO) carriers per redundant link pair
- Redundancy Support: Hardware-based dual-link redundancy with automatic failover in less than 1 second
- Operating Temperature: 0°C to 60°C (32°F to 140°F) industrial grade range
- Storage Temperature: -40°C to 85°C (-40°F to 185°F)
- Power Requirement: Powered via HPM backplane, nominal 5 VDC ±5% logic levels
- Current Consumption: Approximately 1.3 A at 5 VDC typical operation
- Communication Protocol: Proprietary Honeywell HPM I/O Link Protocol
- Slot Configuration: Occupies dedicated I/O Link slots A and B within HPM cabinet for redundancy
- Reliability: Mean Time Between Failures (MTBF) exceeding 150,000 hours in redundant configuration
- Physical Dimensions: Standard Eurocard form factor 100 mm x 160 mm fitting HPM chassis
- Weight: Approximately 0.55 kg including heavy-duty connectors
- Humidity Range: 5% to 95% non-condensing relative humidity
