Honeywell|51454416-200|HPM I/O Link Module
Honeywell 51454416-200 HPM I/O Link Module
Description
Honeywell 51454416-200 is a High Performance Process Manager (HPM) I/O Link Module specifically engineered for the TDC 3000 Distributed Control System to provide redundant high-speed communication links between the HPM processor and Universal I/O carriers.
Honeywell 51454416-200 is a High Performance Process Manager (HPM) I/O Link Module specifically engineered for the TDC 3000 Distributed Control System to provide redundant high-speed communication links between the HPM processor and Universal I/O carriers.
Features
Supports fully redundant I/O link configurations for maximum availability. Connects HPM processors to multiple I/O carriers simultaneously. Ensures deterministic and synchronized data transfer. Compatible with TDC 3000 LCN and UCN network architectures.
Supports fully redundant I/O link configurations for maximum availability. Connects HPM processors to multiple I/O carriers simultaneously. Ensures deterministic and synchronized data transfer. Compatible with TDC 3000 LCN and UCN network architectures.
Technical Specifications
- System Compatibility: Honeywell TDC 3000 LCN/UCN Network Architecture
- Module Type: Redundant HPM I/O Link Interface Board
- Part Number: 51454416-200
- Data Transfer Rate: High-speed synchronous communication optimized for sub-second process control cycles
- I/O Capacity: Supports connection to up to 40 Universal I/O (UIO) carriers per redundant link pair
- Redundancy Support: Hardware-based dual-link redundancy with automatic failover capability
- Operating Temperature: 0°C to 60°C (32°F to 140°F) industrial grade range
- Storage Temperature: -40°C to 85°C (-40°F to 185°F)
- Power Requirement: Powered via HPM backplane, nominal 5 VDC ±5% logic levels
- Current Consumption: Approximately 1.2 A at 5 VDC typical operation
- Communication Protocol: Proprietary Honeywell HPM I/O Link Protocol
- Slot Configuration: Occupies dedicated I/O Link slots A and B within HPM cabinet for redundancy
- Reliability: Mean Time Between Failures (MTBF) exceeding 150,000 hours in redundant configuration
- Physical Dimensions: Standard Eurocard form factor 100 mm x 160 mm fitting HPM chassis
- Weight: Approximately 0.55 kg including heavy-duty connectors
Honeywell|51454416-200|HPM I/O Link Module
Current product
Current
Vendor:
Honeywell
Honeywell|51454416-200|HPM I/O Link Module
Regular price
$100.00
Sale price
$100.00
Regular price
$300.00
Options
Descriptions
Honeywell 51454416-200 HPM I/O Link Module
Description
Honeywell 51454416-200 is a High Performance Process Manager (HPM) I/O Link Module specifically engineered for the TDC 3000 Distributed Control System to provide redundant high-speed communication links between the HPM processor and Universal I/O carriers.
Honeywell 51454416-200 is a High Performance Process Manager (HPM) I/O Link Module specifically engineered for the TDC 3000 Distributed Control System to provide redundant high-speed communication links between the HPM processor and Universal I/O carriers.
Features
Supports fully redundant I/O link configurations for maximum availability. Connects HPM processors to multiple I/O carriers simultaneously. Ensures deterministic and synchronized data transfer. Compatible with TDC 3000 LCN and UCN network architectures.
Supports fully redundant I/O link configurations for maximum availability. Connects HPM processors to multiple I/O carriers simultaneously. Ensures deterministic and synchronized data transfer. Compatible with TDC 3000 LCN and UCN network architectures.
Technical Specifications
- System Compatibility: Honeywell TDC 3000 LCN/UCN Network Architecture
- Module Type: Redundant HPM I/O Link Interface Board
- Part Number: 51454416-200
- Data Transfer Rate: High-speed synchronous communication optimized for sub-second process control cycles
- I/O Capacity: Supports connection to up to 40 Universal I/O (UIO) carriers per redundant link pair
- Redundancy Support: Hardware-based dual-link redundancy with automatic failover capability
- Operating Temperature: 0°C to 60°C (32°F to 140°F) industrial grade range
- Storage Temperature: -40°C to 85°C (-40°F to 185°F)
- Power Requirement: Powered via HPM backplane, nominal 5 VDC ±5% logic levels
- Current Consumption: Approximately 1.2 A at 5 VDC typical operation
- Communication Protocol: Proprietary Honeywell HPM I/O Link Protocol
- Slot Configuration: Occupies dedicated I/O Link slots A and B within HPM cabinet for redundancy
- Reliability: Mean Time Between Failures (MTBF) exceeding 150,000 hours in redundant configuration
- Physical Dimensions: Standard Eurocard form factor 100 mm x 160 mm fitting HPM chassis
- Weight: Approximately 0.55 kg including heavy-duty connectors
